by John H. Lau, S.W. Ricky Lee · McGraw-Hill Professional · tapa dura · ISBN 0639785322092
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«Microvias: For Low Cost, High Density Interconnects» is the technical manual by John H. Lau and S.W. Ricky Lee (McGraw-Hill Professional, hardback, 565 pages).
Technical work on microvia and WLCSP technologies for designing and manufacturing high-density, low-cost interconnects. It explains laser and mechanical drilling processes in printed circuit boards, as well as electronic materials, microelectronic packaging, and cost control in integrated circuits.
First edition published in 2001, within McGraw-Hill's Professional Engineering series; includes illustrations and photographs.
Work for professionals and academics in electronic engineering and telecommunications interested in circuit design and manufacturing.
