by John H. Lau, Ricky S. W. Lee · McGraw-Hill · tapa dura · ISBN 0639785306085
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«Chip scale package» is the technical book by John H. Lau and Ricky S. W. Lee, published by McGraw-Hill in hardback (500 pages, in English).
Technical guide examining the design, materials, processes, reliability, and applications of chip scale packages (CSP). It analyses the innovations required for the miniaturisation of electronic components and details the manufacturing challenges and engineering solutions in the packaging of modern integrated circuits.
The full subtitle is 'Design, Materials, Process, Reliability, and Applications'. Originally published in 1999. The work's categories are Technology and Sciences.
Recommended for engineers and professionals in the semiconductor sector interested in integrated circuit packaging and electronic miniaturisation.
