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3D IC Stacking Technology
3.8
TecnologíaISBN | 9780071741958
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Product details
Pages: 544 pages
Author: Banqiu Wu, Ajay Kumar, Sesh Ramaswami
Publisher: McGraw Hill
ISBN: 9780071741958
Format: tapa dura
Language: en
Release date: 7/7/2011
ISBN: 9780071741958
Synopsis of 3D IC Stacking Technology
Este libro explora los últimos avances en la tecnología de apilamiento de circuitos integrados tridimensionales. Con un enfoque en aplicaciones industriales, ofrece una cobertura completa de los métodos de diseño, prueba y procesamiento de fabricación para la integración de dispositivos tridimensionales. Cada capítulo está escrito por expertos de la industria y detalla un paso de fabricación separado. También se discuten las futuras aplicaciones industriales y el potencial de diseño de vanguardia. Este libro es un recurso esencial para los ingenieros de semiconductores y los diseñadores de dispositivos portátiles.
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